|
Heat
dissipation for microelectronics presents constant challenges as
assemblies become smaller and lighter. Modern CPUs generate 6 times
the power (30W vs 5 W) of previous processors. The smaller size
of the CPUs can cause thermal densities to increase by more than
40 times. Thermal management devices must optimize use of space,
provide lightweight design and remain cost competitive. Magnesium
TXM presents a new generation of lightweight, space-efficient solutions
for heat sinks and thermal management devices.
VOLUMETRIC
THERMAL CONDUCTIVITY
Comparison of relative Volumetric Thermal Conductivity
of selected injection moldable and cast materials.
MAGNESIUM
TXM THERMAL MANAGEMENT ADVANTAGES:
| » |
Low
Density: 79% lighter than copper, 72% lighter than zinc alloys
and 34% lighter than aluminum alloys |
| » |
Low
Density: 79% lighter than copper, 72% lighter than zinc alloys
and 34% lighter than aluminum alloys |
| » |
High
thermal conductivity (72 W/m-K) for fast heat transfer |
| » |
Low
specific heat (1.03 J/g-K) for efficient heat dissipation |
| » |
Readily
joinable and recyclable |
| » |
Multiple
Functionality System Design (MFSD): Heat transfer + Shielding
+ Structure + Recyclable |
TYPICAL PROPERTIES OF TXM ALLOY AZ91D
| Density/Specific
Gravity |
lb/in^3(g/cc) |
0.065(1.81) |
| Typical
Wall Thickness -min |
in(mm) |
0.020(0.50) |
| Electrical
Conductivity |
%IACS |
12 |
| Shielding
Effectiveness @ 0.020" |
dB |
>85 |
| Elastic
Modulus |
MSI
(G Pa) |
6.5(45) |
| Ultimate
Strength |
KSI
(M Pa) |
36(243) |
| Thermal
Conductivity |
Btu/ft-hr-F
(w/m-K) |
41.8(72) |
| Specific
Heat |
Btu
/ lb - F (J/g-K) |
0.245(1.03) |
| UL94
Flame Exposure Results |
|
DNI
/ DNB |
| Material
Composition |
|
Mg
+ 9%AI + 1% Zn |
|
High-efficiency
heat sinks maximize conduction with molded thick sections and optimize
convective cooling with fins and pins narrowing to 0.015 (0.4 mm).
Electronic
housings and business equipment chassis provide structure, shielding
and thermal management in one recyclable component.
|
